Manufacturing method of flexible device substrate
US9484552B2 · kind B2 · utility
0Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Nov 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
A flexible device substrate includes a flexible substrate, a device layer, and a waterproof layer. The flexible substrate has a top surface and a bottom surface disposed opposite to each other. The device layer is disposed on the top surface of the flexible substrate. The waterproof layer is disposed on the bottom surface of the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.