Processes for forming waveguides using LTCC substrates
US9484610B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2015 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Dec 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Processes for forming waveguides (200) using multiple co-planar layers of LTCC substrates (212, 212a, 212b) are described. Registration holes (222) on the substrates help align layering of the substrates. Arrays of circuit patterns are printed on each substrate, with each circuit being made up of conductor pattern (213) and/or via holes (224). Cavity alignment holes (226) formed around a periphery of each circuit allow alignment marks to be printed on the substrates for vision inspection. Similarly, circuit orientation holes (227) associated with each circuit allow orientation marks to be printed on the substrates to identify orientation of circuits in each finally formed waveguide. Substrate orientation holes (225) allow marks to be printed on one side of each substrate for alignment during screen printing. These in-process vision inspections and quality assurance tests allow product quality and process yields to improve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.