Method of manufacturing elastic wave device
US9484885B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2014 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Mar 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an elastic wave device includes a step of preparing a supporting substrate, a step of forming a high-acoustic-velocity film on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a step of forming a low-acoustic-velocity film on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, a step of forming the piezoelectric film on the low-acoustic-velocity film, and a step of forming an IDT electrode on a surface of the piezoelectric film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.