Acoustic wave band reject filter
US9484887B2 · kind B2 · utility
2Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2012 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Feb 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.