Bonding material and bonding body, and bonding method
US9486879B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2011 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Nov 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12479
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 μm or more and 10 μm or less, and an organic material having two or more carboxyl groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.