Method and apparatus for improving selective soldering
US9486880B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2013 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.