Ruggedized MEMS force die
US9487388B2 · kind B2 · utility
26Cited by
135References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2013 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Jun 21, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L5/162
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.