Patent · US Active

Reactive two-component hotmelt adhesive composition

US9487686B2 · kind B2 · utility

0Cited by
2References
19Claims
0Family size

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Inventors

Key dates

Filing dateJun 3, 2014
Grant dateNov 8, 2016
Priority date
Expiry dateMay 30, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2826
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150° C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190° C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.