Weak bond detection
US9488620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2012 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Mar 7, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/02491
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatuses and methods are disclosed for determining whether a structure of bonded layers includes locations where the layers are weakly bonded. Embodiments include evaluating the frequency response of the structure in response to vibrational inputs. Alternate embodiments include evaluating the non-linear response of the structure using a modal analysis. Further embodiments include obtaining the vibrational information with an accelerometer contacting the structure, while additional embodiments include exciting the structure with an impact force, which may be applied at multiple locations on the structure's surface. Still further embodiments include performing a MAC, COMAC, and/or FRF analysis. Still other embodiments include varying the amplitude of the input vibration. Additional embodiments locate the areas of weakened bonding. Still other embodiments include methods and apparatuses for simulating a laminated structure with defective bonding, such as kiss bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.