Optical subassembly, optical system and method
US9488785B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2014 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4239
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is an optical subassembly (1) including a carrier substrate (2), a photonic integrated circuit (3) (PIC) including a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) including a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than 10 μm. Also disclosed is an optical system (12) including such optical subassembly and a method of fabricating such optical subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.