Chip electronic component
US9490062B2 · kind B2 · utility
7Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2014 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Aug 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/0066
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip electronic component may include: a magnetic body including an insulating substrate; internal conductive pattern parts disposed on at least one surface of the insulating substrate; external electrodes disposed on the magnetic body and connected to the internal conductive pattern parts; and an additional magnetic layer disposed on a bottom surface of the magnetic body and covering portions of the external electrodes disposed on the bottom surface of the magnetic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.