Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same
US9490228B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Mar 28, 2014 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Jun 14, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.