Film interposer for integrated circuit devices
US9490240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Nov 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.