Patent · US Active

Method for producing an optoelectronic semiconductor device, and optoelectronic semiconductor device

US9490397B2 · kind B2 · utility

5Cited by

10References

9Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Stephan Preuβ · Bad Abbach, DE
Michael Zitzlsperger · Regensburg, DE
Caroline Kistner · Regensburg, DE

Key dates

Filing date	Dec 17, 2013
Grant date	Nov 8, 2016
Priority date	—
Expiry date	Dec 17, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/882
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.