Laser systems and apparatus for the removal of structures
US9492885B2 · kind B2 · utility
17Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2015 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE02B2017/0052
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.