Wafer level MEMS force dies
US9493342B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2013 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Nov 12, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L5/162
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.