Additive for a silicone encapsulant
US9493634B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2014 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Sep 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An additive for a silicone encapsulant has the structure: (I) R1Ce(OSi—R2) I I a R3 wherein a is 3 or 4, wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.