Resin blend
US9493644B2 · kind B2 · utility
1Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2014 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | May 23, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31924
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a resin blend, which includes a first resin, and a second resin having hydrogen-binding donor and acceptor, and having a difference in surface energy from the first resin at 25° C. of 0.1 to 35 mN/m, and is formed in a layer-separated structure, a pellet, a method of manufacturing the same, and a resin molded article having a specific layer-separated structure. Because of the resin blend, a molded article may have enhanced mechanical properties and surface hardness, and additional surface coating may be omitted, thereby reducing a processing time, increasing productivity, and reducing production costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.