Electrically conductive structural adhesive
US9493682B2 · kind B2 · utility
0Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | May 2, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to electrically conductive, curable compositions, which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.