Patent · US Active

Heat-curing reactive systems

US9493687B2 · kind B2 · utility

2Cited by

3References

14Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Ralf Sauer · Overpelt, BE
Peter Born · Sandhausen, DE
Mathias Müller · Viersen, DE

Key dates

Filing date	Dec 12, 2014
Grant date	Nov 15, 2016
Priority date	—
Expiry date	Aug 31, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L13/00
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present application provides heat-curing preparations containing (a) a triglyceride fraction, the fatty acid distribution of which has a proportion of at least 5 wt. %, in particular at least 60 wt. %, of one or more Ω-3 fatty acids and/or one or more Ω-6 fatty acids, (b) at least one vulcanizing agent selected from the group consisting of (b1) sulfur, (b2) peroxidic vulcanizing agents, (b3) quinones and/or quinone dioximes and/or (b4) dinitrosobenzenes, and (c) at least one inorganic filler.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.