Electronic device housing
US9494982B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2014 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Nov 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device housing is described that includes a substantially flat support plate comprising a composite material and an edge frame comprising a foam material. The edge frame is coupled to the support plate at a perimeter of the support plate and defines a cavity. One or more electronic components may be disposed in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.