Laser etching method for transparent conductive plate and transparent conductive plate prepared thereby
US9496074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2015 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Jun 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser etching method for a transparent conductive plate includes the steps as follows: providing a transparent conductive plate having a transparent conductive layer; continuingly emitting a plurality of laser beams to the transparent conductive layer, and controlling the center points of the laser beams to move in a front path and a rear path partially overlapping a beginning portion of the front path for forming an end connection groove connecting the beginning and the end thereof, or controlling the center points of the laser beams to move in a transverse path and a longitudinal path without overlapping the transverse path for forming a T-shaped groove, or controlling the center points of the laser beams to sequentially move in a first path, a curve path, and a second path substantially perpendicular to the first path for forming a curve groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.