Photonic transceiving device package structure
US9496959B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2015 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Jul 1, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/212
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.