Power module including first and second sealing resins
US9497873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2013 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Jul 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20418
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Sealing force between a metal case and a power semiconductor module is improved. In a power semiconductor module 3, peripheral side surfaces of power semiconductor devices 31U and 31L and conductor plates 33 to 36 are integrated by being covered with a first sealing resin 6. An oxide layer (rough surface layer) 46 is formed on an inner surface of a metal case 40. A fluid resin material is injected into a space S between the oxide layer 46 provided to the metal case 40 and a power semiconductor module 30, and then a second sealing resin 52 is formed. The second sealing resin 52 fills dents of the oxide layer 46, and therefore sealing force improves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.