Patent · US Active

Multi-layered structure and method

US9498142B2 · kind B2 · utility

1Cited by

2References

13Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Jami Hafiz · Cedar Park, US
Stefan Schibli · Frankfurt, DE
Jens Troetzschel · Bruchköbel, DE

Key dates

Filing date	Jul 3, 2014
Grant date	Nov 22, 2016
Priority date	—
Expiry date	Jul 25, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10K85/1135
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.