Vertically hybridly integrated assembly having an interposer for stress-decoupling of a MEMS structure, and method for its manufacture
US9499398B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2015 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jun 10, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0792
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A structural concept for a vertically hybridly integrated assembly having at least one MEMS component is provided, whose MEMS structure is developed at least partially in the front side of the component and which is electrically contactable via at least one connection pad on the front side of the component. This structural concept is able to be realized in an uncomplicated and cost-effective manner and allows the largely stress-free mounting of the MEMS structure within the chip stack and also ensures a reliable electrical linkage of the MEMS component to further component parts of the assembly. For this purpose, the structural concept provides for mounting the MEMS assembly headfirst on a further component of the chip stack via an interposer and for electrically linking it to the further component via at least one plated contacting in the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.