Method for producing bonds

US9499722B2 · kind B2 · utility

Assignee

• TESA SA · CH

Inventors

• Gabriel Dalmis · Hamburg, DE
• Niko Diamantis · Leck, DE
• Thilo Dollase · Hamburg, DE

Key dates

• Filing date: Oct 5, 2010
• Grant date: Nov 22, 2016
• Expiry date: Jul 30, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/1476
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to a method for producing a bonding of two substrates of which at least one is transparent and of which at least one has a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum, comprising the use off a double-sided adhesive product having a first and a second adhesive surface, wherein the first adhesive surface is covered by a first separating layer and the second adhesive surface is covered by a second separating layer, wherein the pull-off force of the first separating layer from the first adhesive surface, AZK1, is less than the pull-off force of the second separating layer from the second adhesive surface, AZK2, and wherein the ratio of adhesion force of the fresh bond of the first adhesive surface on a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum (KKfresh, measured according to test method B) to the pull-off force (measured according to test method A) of the second separating layer from the second adhesive surface, KKfresh: AZK2, equals at least 13.5, comprising the following step: (a) removing the first separating layer from the first adhesive surface and bringing the f…