Method of manufacturing device substrate and display device manufactured using the same
US9500890B2 · kind B2 · utility
2Cited by
1References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jun 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7624
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of manufacturing a device substrate includes forming a surface modifying layer on a process substrate. The surface modifying layer has a different hydrophobicity from that of the process substrate. The process substrate is disposed on a carrier substrate. The surface modifying layer is disposed between the process substrate and the carrier substrate. A device is formed on the process substrate. The process substrate is separated from the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.