Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material
US9501112B2 · kind B2 · utility
3Cited by
5References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 10, 2013 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Aug 10, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.