Method of manufacturing a functional inlay
US9501733B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2012 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jul 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of manufacturing a functional inlay comprises the steps of: —) providing a support layer with at least a first and a second side —) embedding a wire antenna in said support layer —) processing said support layer with said embedded wire antenna to a connection station in which —) said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; —) said support layer is approached on said second side by a connection device; and —) said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.