Patent · US Active

Method for detecting defects during a laser-machining process and laser-machining device

US9501821B2 · kind B2 · utility

5Cited by

4References

14Claims

0Family size

Assignee

TRUMPF LASER- UND SYSTEMTECHNIK GMBH · DE

Inventors

Dieter Pfitzner · Weil der Stadt, DE
Holger Braun · Renningen, DE
Friedhelm Dorsch · Stuttgart, DE

Key dates

Filing date	Dec 26, 2013
Grant date	Nov 22, 2016
Priority date	—
Expiry date	Sep 21, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Detection of defects during a machining process includes: moving a laser beam along a predefined path over multiple workpieces to be machined so as to generate a weld seam or a cutting gap in the workpieces; detecting, in a two-dimensional spatially resolved detector field of a detector, radiation emitted and/or reflected by the multiple workpieces; selecting at least one detection field section in the detection field of the detector based on laser beam control data defining movement of the laser beam along the predefined path or based on a previously determined actual-position data of the laser beam along the predefined path, wherein each detection field section comprises a region encompassing less than the entire detection field; evaluating the radiation detected in the selected detection field section; and determining whether a defect exists at the weld seam or the cutting gap based on the evaluated radiation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.