Wafer loaders having buffer zones
US9502274B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | May 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67326
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present inventive concepts provide a wafer loader having one or more buffer zones to prevent damage to a wafer loaded in the wafer loader. The wafer loader may include a plurality of loading sections that protrude from a main body and are configured to be arranged at various locations along an edge of the wafer. Each of the loading sections may include a groove into which the edge of the wafer may be inserted. The loading section may include first and second protrusions having first and second inner sides, respectively, that face each other to define the groove therebetween. At least one of the first and second inner sides may include a recess to define the buffer zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.