Semiconductor package with switch node integrated heat spreader
US9502338B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2015 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jul 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one implementation, a semiconductor package includes a patterned conductive carrier including partially etched segments. The semiconductor package also includes a control FET having a control drain attached to a first partially etched segment of the patterned conductive carrier. In addition, the semiconductor package includes a sync FET having a sync source and a sync gate attached to respective second and third partially etched segments of the patterned conductive carrier. The semiconductor package further includes a heat spreading conductive plate situated over a control source of the control FET and over a sync drain of the sync FET so as to couple the control source and the sync drain to a switch node segment of the patterned conductive carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.