Process for connecting joining parts
US9502376B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Mar 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for connecting parts to be joined. A first layer sequence is applied to a first part to be joined. The first layer sequence contains silver. A second layer sequence is applied to a second part to be joined. The second layer sequence contains indium and bismuth. The first layer sequence and the second layer sequence are pressed together at their end faces respectively remote from the first part to be joined and the second part to be joined through application of a joining pressure at a joining temperature which amounts to at most 120° C. for a predetermined joining time. The first layer sequence and the second layer sequence fuse together to form a bonding layer which directly adjoins the first part to be joined and the second part to be joined and the melting temperature of which amounts to at least 260° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.