Patent · US Active

Patterned thin foil

US9502596B2 · kind B2 · utility

0Cited by
1References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 28, 2013
Grant dateNov 22, 2016
Priority date
Expiry dateMar 11, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50

Abstract

An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the reusable carrier. The metal foil may be patterned without damaging the reusable carrier. A semiconductor structure (e.g., a solar cell) may be attached to the patterned metal foil. The reusable carrier may then be removed. In some embodiments, the semiconductor structure may be encapsulated using an encapsulant, with the adhesive being compatible with the encapsulant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.