LED assembly

US9502622B2 · kind B2 · utility

Assignees

• Huga Optotech Inc. · TW
• Interlight Optotech Corporation · TW

Inventors

• Tzer-Perng Chen · Hsinchu, TW
• Tzu-Chi Cheng · Yangmei District, TW

Key dates

• Filing date: Sep 23, 2014
• Grant date: Nov 22, 2016
• Expiry date: Sep 23, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181

Abstract

This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.