Manufacturing electrochemical sensor modules
US9504162B2 · kind B2 · utility
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155References
9Claims
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Key dates
| Filing date | May 18, 2012 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Certain processes for manufacturing an electrochemical sensor module include etching a Silicon wafer to form precursor sensor bodies, disposing sensor fibers along rows of the precursor sensor bodies, securing a rigid layer over the sensor fibers, dividing the wafer, rigid layer, and sensor fibers into individual precursor sensor bodies, and joining each precursor sensor body to a component body to form sensor modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.