Heatpipe imbedded coldplate enhancing IGBT heat spreading
US9504186B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Jan 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cold plate for a power circuit is disclosed. The power circuit includes a plurality of transistors and each of the plurality of transistors includes a plurality of dies. The cold plate includes a liquid cooling system that includes a plurality of cooling channels and each of the plurality of cooling channels is aligned with at least one die. The liquid cooling system includes a heat sink associated with each of the plurality of cooling channels. The cold plate further includes a plurality of heat pipes, wherein each of the plurality of heat pipes is aligned with at least one of the plurality of cooling channels and at least one die. Each heat pipe includes a wick lining an interior of the heat pipe, a vapor flow area, and a fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.