Compound, composition comprising the compound and cured product
US9504632B2 · kind B2 · utility
1Cited by
4References
18Claims
0Family size
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Key dates
| Filing date | May 15, 2012 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Oct 8, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2603/66
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.