Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer
US9504840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2015 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Mar 28, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49227
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.