Heat-shrinkable laminate film
US9505195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2015 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | May 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-shrinkable laminate film includes layer (A) and layer (B) laminated via an interface having an interlayer strength of ≦0.5 N/15 mm, in which layer (A) has at least a substrate layer containing a polypropylene-based resin, layer (B) has at least a seal layer containing a polyethylene-base resin, and any of the following is satisfied: (1) the difference in heat shrinkage rate between layer (A) and layer (B) is ≦10% at 100° C., and the laminate film includes a gas barrier layer containing a saponified ethylene-vinyl alcohol copolymer and has an oxygen transmission rate of ≦60 cc/m2·day·atm; and (2) the difference in heat shrinkage rate between layer (A) and layer (B) is ≦20% at 100° C., and the heat-shrinkable laminate film includes a gas barrier layer containing an aromatic polyamide-based copolymer and has an oxygen transmission rate of ≦60 cc/m2·day·atm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.