Devices and methods for solder flow control in three-dimensional microstructures
US9505613B2 · kind B2 · utility
12Cited by
167References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Sep 24, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.