Patent · US Active

Polyamide molding materials with improved thermal aging and hydrolysis stability

US9505912B2 · kind B2 · utility

3Cited by

16References

20Claims

0Family size

Assignee

BASF SE

Inventors

Peter Eibeck · Speyer, DE
Jochen Engelmann · Neustadt, DE
Ralf Neuhaus · Drensteinfurt, DE
Anka Bernnat · Schifferstadt, DE

Key dates

Filing date	Aug 7, 2007
Grant date	Nov 29, 2016
Priority date	—
Expiry date	Aug 2, 2029

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K13/04
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding compositions, comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.