Phenol resin molding material, friction material, and phenol resin molded product
US9505925B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | May 2, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16D69/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A phenol resin molding material includes a modified olefin-based polymer particle (I) and a phenol resin (II). It is preferable that the modified olefin-based polymer particle (I) satisfy at least one of the requirements (A), (B), and (C) which are defined as follows: (A) Inclusion of at least one element selected from a group consisting of a group 15 element, a group 16 element, and a group 17 element of the periodic table. (B) When the whole of the above-described olefin-based polymer particle (I) is set as 100 wt %, the content of the above-described elements is greater than or equal to 0.05 wt % and less than or equal to 50 wt %. (C) MFR which is measured under the conditions of 190° C. and 2.16 kgf based on JIS K 7210 is greater than or equal to 0.001 g/10 minutes and less than 3 g/10 minutes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.