Thermally decomposable polymer compositions for forming microelectronic assemblies
US9505948B2 · kind B2 · utility
1Cited by
5References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 12, 2013 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Dec 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0485
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A thermally decomposable polymer composition comprising a polyester containing repeating units of an ester of diglycolic acid and difunctional tertiary alcohol are disclosed, which are useful in the forming of microelectronic assemblies. A representative example of a composition comprises a thermally decomposable polymer of the formula:wherein n is at least about 20, which provides both tackiness and solder fluxing, among other benefits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.