Patent · US Active

Sensor chip

US9506885B2 · kind B2 · utility

2Cited by

6References

20Claims

0Family size

Assignee

Sensirion AG · CH

Inventors

Felix Mayer · Männedorf, CH
Ulrich Bartsch · Ilsenburg, DE
Martin Winger · Männedorf, CH
Markus Graf · Zürich, CH
Pascal Gerner · Zürich, CH

Key dates

Filing date	Sep 10, 2015
Grant date	Nov 29, 2016
Priority date	—
Expiry date	Sep 10, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/18
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.