Substrate processing apparatus and substrate processing method
US9508573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2012 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Mar 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing liquid is supplied onto a substrate rotated by a spin chuck in a coating processing unit so that a film of the processing liquid is formed, and a rinse liquid is supplied to a peripheral edge of the substrate so that a processing liquid on the peripheral edge of the substrate is removed. An edge cut width between a position of an outer peripheral portion of the substrate rotated by the spin chuck in an edge exposure unit and a position of an outer peripheral portion of a film on the substrate is detected. Based on the detected edge cut width, a positional deviation of the center of the substrate held in the spin chuck from a rotation center of the spin chuck in the coating processing unit is determined while a supply state of the rinse liquid by an edge rinse nozzle is determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.