Semiconductor device with heat sinks
US9508693B2 · kind B2 · utility
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2References
15Claims
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Assignee
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Key dates
| Filing date | Sep 29, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Sep 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/116
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated heat sink array is introduced in SOI power devices having multiple unit cells, which can be used to reduce the temperature rise in obtaining more uniform temperature peaks for all the unit cells across the device area, so that the hot spot which is prone to breakdown can be avoided, thus the safe operating area of the device can be improved. Also the array sacrifice less area of the device, therefore results in low Rdson.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.