Light emitting device package
US9508906B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2015 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Jul 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.