System and apparatus for network device heat management
US9509092B2 · kind B2 · utility
41Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2014 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Feb 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB with at least one slot and a connector cage mounted on the printed circuit board, the connector cage being within a certain distance from the at least one slot in the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.